Description
Some Materials And Recommended Temperature
- Resin ( for filling ) : 39 C°
- Resin ( for bonding ) : 55 C°
- Branscan : 38 C°
- Agar film : Melting 99 C° , Insulation 60 C°
- Sodium Hypochlorite : 60 C°
Some Materials And Recommended Temperature
- Resin ( for filling ) : 39 C°
- Resin ( for bonding ) : 55 C°
- Branscan : 38 C°
- Agar film : Melting 99 C° , Insulation 60 C°
- Sodium Hypochlorite : 60 C°
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