Description
Specification
Light-curing 1-component self-etch adhesive to create a permanent, marginal-gap-free adhesion between the tooth structure and the light-curing filling/fixing material.
demonstrably free of BisGMA, TEGDMA and HEMA
very high adhesion values
time-saving processing on the patient, therefore particularly suitable for children
can be used for all etching techniques (non-etch, total-etch, selective etch etc.)
Adhesion values Dr. Uwe Blunck, University medicine Berlin:
Dentine
Etch & Rinse: 34.15 MPa
Self-Etch: 25.60 MPa
Enamel
Etch & Rinse: 27.78 MPa
Self-Etch: 15.12 MPa
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