Description
Description :
TOKUYAMA® EE-BOND is a dental adhesive system formulated for the enamel-etching technique. Utilizing Tokuyama’s 3D self-reinforcing (SR) monomer, TOKUYAMA® EE-BOND chemically bonds to both enamel and dentin forming a durable 3D matrix bonding layer. This thin but durable bonding layer offers long-term marginal integrity of the esthetic restoration as well as exceptional dentinal sealing.
Benefits :
- Outstanding adhesion performance
- Dependable marginal integrity (Minimized micro-leakage)
- Reduced post-operative sensitivity
- Perfect cavity sealing
- Less technique sensitivity
- Prolonged working time
- Fluoride releasing
Indications
- Bonding of light- or dual-cured composite to:
- cut/uncut enamel
- cut/uncut dentin
- fractured porcelain/composite repair
- Simple Steps
Simple Steps :
Direct restorations and Intraoral repair of restorations with Composite Resin
Dependable Marginal Integrity :
No marginal leakage observed.(Result of dye immersion test*)
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